Semicon West 2012 was a busy time for the Metryx team with the introduction of three dimensional devices continuing to drive interest in mass metrology. In particular, 3DIC was the subject of much attention where a joint Metryx-IMEC review of mass metrology in the TSV module was presented at the SEMATECH Workshop on 3D Interconnect Metrology.

The workshop was very well attended and featured over a dozen speakers focussing on the challenges presented by 3D architectures. The Metryx paper "Using Mass Metrology for Process Monitoring and Control During 3D Interconnect of IC's" can be downloaded here.

Metryx also contributed to a supplier discussion on 3DIC readiness at Semicon West, hosted by 3D Incites. The role of mass metrology in monitoring high aspect ratio TSV's was highlighted as a way to rapidly catch unexpected process variations by the measurement of global wafer mass change. Click here to hear what Metryx and other suppliers have to say about this subject.

Finally, Metryx were delighted to co sponsor the Impress Lounge event at Semicon West located in the B-Bar in Yerba Buena gardens above Moscone North. Not only did this give our visiting customers somewhere cool and calm to relax away from the hustle of the main exhibits, but also access to the now legendary Impress after show party, voted as "Best in West" for the fifth year in a row.

Downloads and links:

Using Mass Metrology for Process Monitoring and Control During 3D Interconnect of ICs

Suppliers Discuss 3D IC Readiness at Semicon West

Sematech 3D IC Metrology Workshop Agenda